Mechanical properties of HIP bonded W and Cu-alloys joint for plasma facing components

Saito, Shigeru; Fukaya, Kiyoshi*; Ishiyama, Shintaro; Sato, Kazuyoshi

Journal of Nuclear Materials, 307-311(2), p.1542 - 1546, 2002/12

https://doi.org/10.1016/S0022-3115(02)01169-8

no abstracts in English

Development of bonding techniques between tungsten and copper alloy for plasma facing components by HIP method, 2; Bonding between tungsten and DS-copper

Saito, Shigeru; Fukaya, Kiyoshi; Ishiyama, Shintaro; Eto, Motokuni; Akiba, Masato

JAERI-Research 2000-006, p.57 - 0, 2000/02

JAERI-Research-2000-006.pdf:20.86MB

no abstracts in English

None

; ; ; Hayashi, Shinichiro; ;

PNC TN8410 96-055, 147 Pages, 1998/02

PNC-TN8410-96-055.pdf:4.96MB

None

Preliminary characterization of interlayer for Be/Cu functionally gradient materials; Thermophysical properties of Be/Cu sintered compacts

Saito, Shigeru; *; *; Kawamura, Hiroshi

Functionally Graded Materials 1996, 0, p.215 - 220, 1996/00

no abstracts in English